On Tuesday, G.Skill revealed its latest advancement in memory technology: ultra-low-latency DDR5-6400 memory modules featuring a CAS latency of just 30 clocks. This sets a new benchmark in the industry, showcasing some of the fastest timings seen for DDR5-6400 modules. These advanced sticks will support both AMD and Intel processor-based systems.
DDR memory, with each new generation, pushes forward in terms of data transfer rates, often accompanied by an increase in relative latencies. Typically, the extra bandwidth these newer modules offer makes up for any performance dip due to higher latencies. However, certain applications benefit more from reduced latency, making these low-latency modules highly sought after but hard to find. This is because cutting down latencies is often more challenging than boosting data rates.
Despite these challenges, G.Skill has succeeded in sourcing high-quality DDR5 memory chips and crafting suitable printed circuit boards to develop their DDR5-6400 modules with CL30 timings. This drastically lowers the latency compared to the CL46 timings suggested by JEDEC for similar speed modules. G.Skill’s latest offerings stand out with an impressive reduction to just 9.375 ns in absolute latency, about 35% less than what you get with JEDEC-standard modules, which sit at 14.375 ns.
These DDR5-6400 CL30 modules come with a 16 GB capacity and will be offered in dual-channel kits of 32 GB sets. While G.Skill hasn’t shared specific voltage requirements, it’s reasonable to expect them to be above JEDEC’s standard.
G.Skill is gearing up to roll out these modules for AMD systems that use EXPO profiles, under products like the Trident Z5 Neo RGB and Trident Z5 Royal Neo lines, as well as for Intel systems supporting XMP 3.0 profiles through their Trident Z5 RGB and Trident Z5 Royal series. Particularly for AMD’s AM5 systems, which top out around 6000 MT/s to 6400 MT/s for DDR5 memory compatibility at a 1:1 Infinity Fabric ratio, these new modules could really enhance the performance of AMD’s Ryzen 7000 and Ryzen 9000-series chips.
It’s worth noting that these unique, non-standard modules won’t be compatible with every setup. They are best suited to high-end motherboards equipped with efficient CPU cooling solutions.
Starting late August 2024, these cutting-edge memory kits will be distributed globally through G.Skill’s partner network. The company hasn’t announced the pricing yet, but given the premium nature and the distinct specifications of these modules, anticipate a price that reflects their advanced capabilities.
